专利名称：Heat resistant silicone compositions发明人：Ishikawa, Hiroki, Dow Corning
Toray,Naganawa, Tsutomu, Dow CorningToray,Ona, Isao
申请号：EP95102444.7申请日：19950221公开号：EP0668137A2公开日：19950823
摘要：The present invention relates to a silicone composition comprising a mixture of(A) an amino-functional diorganopolysiloxane oil free of phenol groups and having atleast 1 amino group per molecule and (B) a diorganopolysiloxane oil free of aminogroups and having at least 1 phenol group per molecule. The silicone composition has aviscosity of from 10 to 100,000 mm/s at 25°C and an average phenol equivalent weight of10,000 to 5,000,000. The silicone compositions of the present invention are highly heat-resistant, exhibit excellent release properties, and superior lubrication properties.
申请人：Dow Corning Toray Silicone Company, Limited
地址：Mitsui Bldg. No. 6, 2-3-16, Nihonbashi-Muromachi, Chuo-Ku Tokyo 103 JP
国籍：JP
代理机构：Spott, Gottfried, Dr.
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