Thermosetting resin composition and its article

专利名称：Thermosetting resin composition and its

article

发明人：Hatsuo Ishida,Koichi Shibayama,Hiroshi Abe申请号：US10811952申请日：20040330

公开号：US20070191555A1公开日：20070816

摘要： The invention provides a thermosetting resin composition comprising abifunctional dihydrobenzoxazine compound and an epoxy compound, and provides athermosetting resin molding obtained by thermally curing the thermosetting resincomposition. The molding has excellent electric properties of low dielectric constant andlow dielectric loss tangent. The resin composition comprises an epoxy compound and abifunctional dihydrobenzoxazine compound of the following general formula (1), whereinthe equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazinecompound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2carbon atoms, or a branched alkylene group derived from it by substituting the

hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ringmay be substituted with an alkyl group or an alkoxy group.

申请人：Hatsuo Ishida,Koichi Shibayama,Hiroshi Abe

地址：Shaker Heights OH US,Osaka JP,Osaka JP

国籍：US,JP,JP

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