专利名称：Multilayered structure and method of
manufacturing the same, and ultrasonictransducer
发明人：Toshiaki Kuniyasu,Hiroshi Maeda,Kazuhiro
Nishida,Takayuki Fujiwara
申请号：US11030069申请日：20050107公开号：US07199509B2公开日：20070403
专利附图：
摘要：A multilayered structure which includes insulating layers and electrode layersand can be easily arrayed. The multilayered structure is manufactured by using asubstrate on which first and second groups of columnar structures are arranged in apredetermined arrangement, and includes: a first electrode layer formed by forming afilm of a conducting material on the substrate or an insulating layer except for portionsaround the first group of columnar structures; an insulating layer formed by sprayingpowder of an insulating material on the first electrode layer to deposit the powderthereon; a second electrode layer formed by forming a film of a conducting material onthe insulating layer except for portions around the second group of columnar structures;
and interconnections formed by filing, with a conducting material, holes formed byremoving the columnar structures from the substrate.
申请人：Toshiaki Kuniyasu,Hiroshi Maeda,Kazuhiro Nishida,Takayuki Fujiwara
地址：Kaisei-machi JP,Minami-Ashigara JP,Minami-Ashigara JP,Minami-Ashigara JP
国籍：JP,JP,JP,JP
代理机构：Sughrue Mion, PLLC
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