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RTL8192DU

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BL‐R8192RD1ProductSpecification

IEEE802.11a/b/g/n(2T2R)WLANUSBModule

Version:1.0

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B‐LINKELECTRONICCO.,LTDinshenzhen

Content

Content.................................................................................................................................................................10.RevisionHistory...............................................................................................................................................21.GeneralDescription.........................................................................................................................................22.ProductSpecification.......................................................................................................................................22.1FunctionBlockdiagram..............................................................................................................................22.2ElectricalandPerformanceSpecification...................................................................................................32.3DCCharacteristic........................................................................................................................................42.4ProductPhoto.............................................................................................................................................42.5MechanicalSpecification............................................................................................................................52.6ProductPinDefinition................................................................................................................................53.Supportedplatform.........................................................................................................................................64.PeripheralSchematicReferenceDesign.........................................................................................................64.1WiFiRFCircuitreferencepictures.................................................................................................................64.2USBInterfaceElectricalCharacteristic..........................................................................................................75.TypicalSolderReflowProfile...........................................................................................................................7

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B‐LINKELECTRONICCO.,LTDinshenzhen

0.RevisionHistory

Date

Documentrevision1.0

ProductrevisionV1.0

ChangeDescription

2013/05/09

Draftinitialrelease

1.GeneralDescription

BL‐R8192RD1productisdesignedbaseonRealtekRTL8192DUchipset.ItcombinesCMOSMAC,BasebandPHYandRFinasinglechipforIEEE802.11a/b/g/ncompatible.ItsupportsIEEE802.11isafetyprotocol,alongwithIEEE802.11estandardservicequality.Itsupportsthenewdataencryptionon64/128bitWEPandsafetymechanismonWPA‐PSK/WPA2‐PSK,WPA/WPA2.Itcanimplementthewirelessnetworkfunctiononthelaptop/desktop/MIDandotherwirelessdeviceseasily.Thismodulehasimplementedsomeefficientmechanismsinitssoftwareandhardwaretomaximizetheperformance.

2.ProductSpecification

2.1FunctionBlockdiagram

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B‐LINKELECTRONICCO.,LTDinshenzhen

2.2ElectricalandPerformanceSpecification

Item

ProductNameMajorChipsetHostInterfaceStandardFrequencyRangeModulationTypeWorkingModeDataTransferRate

DescriptionBL‐R8192RD1RTL8192DU‐VS

USB2.0

IEEE802.11a,IEEE802.11b,IEEE802.11g,IEEE802.11n,

2.4GHz~2.4835GHz5.15GHz~5.845GHz

802.11b:CCK,DQPSK,DBPSK

802.11a/g:64-QAM,16-QAM,QPSK,BPSK802.11n:64-QAM,16-QAM,QPSK,BPSK

SpreadSpectrum

Sensitivity@PERRFPowerAntennatype

ThetransmitdistanceDimension(L*W*H)Powersupply

PowerConsumptionClocksource

WorkingTemperatureStoragetemperature

Infrastructure,Ad‐Hoc

1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120andmaximumof300Mbps

IEEE802.11a:ISM(IndustrialScientificMedical)

IEEE802.11b:DSSS(DirectSequenceSpreadSpectrum)IEEE802.11g/n:OFDM(OrthogonalFrequencyDivisionMultiplexing)

1M:‐90dBm@8%PER6M:‐88dBm@10%PER11M:‐85dBm@8%PER54/135M:‐73dBm@10%PER

<18dBm@11b,<14dBm@11g,<13dBm@11n,<12dBm@11aConnecttotheexternalantennathroughthehalfhole

Indoor100M,Outdoor300M,accordingthelocalenvironment27.0x17.7x1.9mm(LxWxH);Tolerance:+‐0.2mm3.3V+/‐0.2V

standbymode203mA@3.3V,

TXmode381mA@3.3V

40MHz

‐20ºCto+70ºC‐55°C~+125°C

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B‐LINKELECTRONICCO.,LTDinshenzhen

2.3DCCharacteristic

SymbolVD33A,VD33DVD12A,VD12DVD15A,VD15D

Parameter3.3VI/OSupply

Voltage1.2VCoreSupplyVoltage1.5VSupplyVoltage

Minimum3.1351.101.425

Typical3.31.21.5

Maximum3.4651.321.575

Unitsvvv

2.4ProductPhoto

TOP

Bottom

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B‐LINKELECTRONICCO.,LTDinshenzhen

2.5MechanicalSpecification

Moduledimension:Typical(WxLxH):27mmx17.7mmx1.9mm

2.6ProductPinDefinition

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B‐LINKELECTRONICCO.,LTDinshenzhen

3.Supportedplatform

OperatingSystemWIN2000/XP/VISTA/WIN7

LINUX2.4/2.6WINCE5.0/6.0

CPUFrameworkX86PlatformARM,MIPSIIARM,MIPSII

DriverEnableEnableEnable

4.PeripheralSchematicReferenceDesign

4.1WiFiRFCircuitreferencepictures

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B‐LINKELECTRONICCO.,LTDinshenzhen

4.2USBInterfaceElectricalCharacteristic

5.TypicalSolderReflowProfile

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