MAX3223E

RELIABILITY REPORT

FORMAX3223ExxP

PLASTIC ENCAPSULATED DEVICES

September12, 2001

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.SUNNYVALE, CA 94086

Written byReviewed by

Jim PedicordQuality AssuranceReliability Lab ManagerBryan J. PreeshlQuality AssuranceExecutive Director

Conclusion

The MAX3223E successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.Table of Contents

I. ........Device DescriptionV. ........Quality Assurance InformationII. ........Manufacturing InformationVI. .......Reliability EvaluationIII. .......Packaging InformationIV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX3223E is a 3V-powered EIA/TIA-232 and V.28/V.24 communications interface with automaticshutdown/wakeup features, high data rate capabilities, and enhanced electrostatic discharge (ESD) protection. All transmitter outputs and receiver inputs are protected to ±15kV using IEC 1000-4-2 Air-Gap Discharge, to ±8kV using IEC 1000-4-2 Contact Discharge, and to ±15kV using the Human Body Model.

The MAX3223E achieves a 1µA supply current with Maxim’s revolutionary AutoShutdown feature. It saves power without changes to the existing BIOS or operating system by entering low-power shutdown mode when the RS-232cable is disconnected, or when the transmitters of the connected peripherals are off.

This transceiver has a proprietary low-dropout transmitter output stage, delivering true RS-232 performance from a +3.0V to +5.5V supply with a dual charge pump. The charge pump requires only four small 0.1µF capacitors for operation from a +3.3V supply. The MAX3223E is guaranteed to run at data rates of 250kbps while maintaining RS-232 output levels. The MAX3223E contains two drivers and two receivers

B. Absolute Maximum Ratings

ItemVCC to GND

V+ to GND (Note 1)V- to GND (Note 1)V+ + |V-| (Note 1)Input Voltages

T_IN, /EN, FORCEON, /FORCEOFF to GND R_IN to GNDOutput Voltages T_OUT to GND

R_OUT, R2OUTB, /INVALID to GNDShort-Circuit Duration T_OUT to GNDStorage Temp.

Lead Temp. (10 sec.)Power Dissipation 20-Pin DIP 20-Pin SSOP 20-Pin TSSOPDerates above +70°C 20-Pin DIP 20-Pin SSOP 20-Pin TSSOP

Rating-0.3V to +6V-0.3V to +7V+0.3V to -7V+13V-0.3V to +6V±25V

±13.2V

-0.3V to (VCC + 0.3V)Continuous

-65°C to +160°C +300°C889mW640mW559mW11.11mW/°C8.0mW/°C7.1mW/°C

Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

II. Manufacturing Information

A. Description/Function: ±15kV ESD-Protected, 1µA, 3.0V to 5.5V, 250kbps, RS-232 Transceiver with AutoShutdown

B. Process: SG3 (Standard 3 micron silicon gate CMOS)C. Number of Device Transistors: 339

D. Fabrication Location: California or Oregon, USAE. Assembly Location: Philippines or MalaysiaF. Date of Initial Production: January, 1998

III. Packaging Information

A. Package Type: 20-Pin PDIP20-Pin SSOPB. Lead Frame:CopperCopperC. Lead Finish: Solder PlateSolder PlateD. Die Attach:Silver-filled EpoxySilver-filled EpoxyE. Bondwire:Gold (1.3 mil dia.)Gold (1.3 mil dia.)F. Mold Material:

Epoxy with silica filler

Epoxy with silica fillerG. Assembly Diagram: # 05-1901-0182# 05-1901-0189

H. Flammability Rating: Class UL94-V0

IV. Die Information

A. Dimensions: 91 x 159 mils

B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)C. Interconnect:

Aluminum/Si (Si = 1%)D. Backside Metallization:None

E. Minimum Metal Width:3 microns (as drawn)F. Minimum Metal Spacing: 3 microns (as drawn)G. Bondpad Dimensions:5 mil. Sq.H. Isolation Dielectric: SiO2

I. Die Separation Method:

Wafer Saw

20-Pin TSSOPCopperSolder PlateSilver-filled EpoxyGold (1.3 mil dia.)Epoxy with silica filler# 05-1901-0202

V. Quality Assurance Information

A.Quality Assurance Contacts:

Jim Pedicord (Reliability Lab Manager)Bryan Preeshl (Executive Director)Kenneth Huening (Vice President)

0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.

B. Outgoing Inspection Level:

C. Observed Outgoing Defect Rate: < 50 ppmD. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (λ) is calculated as follows:

λ = 1 = 8.35 (Chi square value for MTTF upper limit) MTTF192 x 4389 x 360 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eVλ = 13.76 x 10-9

λ = 13.76 F.I.T. (60% confidence level @ 25°C)

This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-InSchematic (Spec. # 06-5072) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1L).B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard85°C/85%RH testing is done per generic device/package family once a quarter.C. E.S.D. and Latch-Up Testing

The RS60-1 die type has been found to have all pins able to withstand a transient pulse of ±3000V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Additionally, the MAX3223E has achieved ±15kV ESD protection using both methods 3015 and IEC 801-2 (air-gap discharge) on the I/O pins.Latch-Up testing has shown that this device withstands a current of ±250mA and/or ±20V.

Table 1

Reliability Evaluation Test Results

MAX3223ExxP

TEST ITEM

TEST CONDITION

FAILURE

IDENTIFICATION

SAMPLESIZE

NUMBER OFFAILURES

PACKAGE

Static Life Test (Note 1)

Ta = 135°CBiased

Time = 192 hrs.Moisture Testing (Note 2)Pressure Pot

Ta = 121°CP = 15 psi.RH= 100%Time = 168hrs.Ta = 85°CRH = 85%Biased

Time = 1000hrs.

DC Parameters& functionality

3600

DC Parameters& functionality

(generic test vehicle)PDIPSSOPTSSOP8030077010

85/85

DC Parameters& functionality

(generic test vehicle)

770

Mechanical Stress (Note 2)TemperatureCycle

-65°C/150°C1000 CyclesMethod 1010

DC Parameters

(generic test vehicle)

77

0

Note 1: Life Test Data may represent plastic D.I.P. qualification lots.Note 2: Generic Package/Process data