专利名称：HEAT SINK ASSEMBLY发明人：XIAO-FENG MA,LEI LIU申请号：US13455145申请日：20120425
公开号：US20130155623A1公开日：20130620
专利附图：
摘要：A heat sink assembly includes a heat sink, two first fixing structures, and twosecond fixing structures. The heat sink includes a base. The base includes two oppositesidewalls each forming a fixing portion. When the heat sink is mounted to a first
motherboard, the first fixing structures are respectively and detachably connected to the
fixing portions of the heat sink, and fix the heat sink to the first motherboard. When theheat sink is mounted to a second motherboard, the second fixing structures aredetachably connected to fixing portions of the heat sink, and fix the heat sink to thesecond motherboard.
申请人：XIAO-FENG MA,LEI LIU
地址：Shenzhen City CN,Shenzhen City CN
国籍：CN,CN
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