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Electronic Device Assemblies

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专利内容由知识产权出版社提供

专利名称:Electronic Device Assemblies发明人:Kevin D. Gibbs,Carl R. Peterson,Erik A.

Uttermann,Conor P. Lenahan,John P.Ternus,Justin R. Wodrich,Elvis M. Kibiti,DerekWright

申请号:US14258414申请日:20140422

公开号:US20140226291A1公开日:20140814

专利附图:

摘要:An electronic device may have a conductive housing. A dielectric structure may

be mounted in the conductive housing to form an antenna window. An electrical

component such as a camera, light sensor, or other device may press against a conductivefoam structure. A printed circuit may have conductive traces that form an antenna groundand antenna resonating element. The printed circuit may be wrapped around a supportstructure. The electrical component, the conductive foam structure, and the printedcircuit wrapped around the support structure may be compressed between a displaycover layer and the antenna window. A camera window may be attached to a camerawindow trim using multiple adhesives. The trim may have a curved exterior surface thatmatches a curved housing surface. A flexible printed circuit cable may have a foldedportion. A band structure may surround the folded portion to form a service loop.

申请人:Apple Inc.

地址:Cupertino CA US

国籍:US

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